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The conventional wisdom is that optical fiber is dielectric, and thus does not radiate RF emissions.
In practice, optical fiber cable connectors have non-negligible amounts of conductive material, for example a ferrule, spring, and crimp ring. As data rates have increased beyond 1 gigabit/second
(Gbps), equipment with supposedly "RF tight" enclosures exhibited high levels of RF emissions, failing
to meet FCC/European electromagnetic compliance (EMC) requirements. It is hypothesized that these small metallic bits can re-radiate RF emissions due to capacitive coupling, and a model is proposed. Data is presented to support this mechanism for RF emission, and corrective measures are suggested to reduce these emissions.

About the Presenter:
Robert Dahlgren is President of Silicon Valley Photonics Ltd., a consultancy in advanced optical technology. He has been working in optical technology for more than 20 years. He has previously been employed at Honeywell,
Control Data, Sperry Aerospace, the Charles Stark Draper Laboratory, Transcendata, and Fujikura Technology. He has worked on diverse areas of optical R&D and engineering, such as microlithography, metrology, passive
fiber devices, sensors, avionics, communication transceivers, physics, nuclear testing, and data communications. He is the author of more than ten patents and numerous technical publications, and is a recipient of the IEEE
"3rd Millennium" award. He is active in several optical professional societies, and is the chairman-emeritus of the award-winning Santa Clara Valley chapter of the IEEE Lasers & Electro-Optics Society. He received his
M.S. degree from M.I.T in aeronautics/astronautics in 1993, his second M.S. degree from San Jose State University in physics in 2001, and his B.S.E.E. from the University of Minnesota in 1983.

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About the Presenter:
Lee Ritchey, BSEE, is owner of Speeding Edge, a consulting firm specializing in high-speed design consulting and training.  Prior to forming Speeding Edge, Mr. Ritchey spent five years as Director of Electronic Packaging Engineering at 3Com Corporation, a major manufacturer of high performance networking equipment.  For ten years prior to that, he was a cofounder and Vice President of Engineering at Shared Resources, a company that specialized in the design of high performance printed circuit boards for the supercomputing industry.  He has more than 30 years experience in the packaging of high performance equipment ranging from microwave satellites to super computers.  He is currently working with major suppliers of gigabit and beyond internet products as well as a variety of wireless products.  Mr. Ritchey has been on the editorial review board for Printed Circuit Design Magazine and is a regular contributor of design articles to a variety of publications.  He has taught his High Speed Design course to more than 3000 engineers and designers in several countries.  He is a regular lecturer at the Printed Circuit Design Conference, the IPC conferences and at UC Berkeley Engineering Extension.

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About the Presenter:
Darryl Ray is a senior EMC engineer at Apple Computer, in charge of the EMC compliance for the server and high-end desktop product line.  He is a Senior Member of the IEEE with more than 20 years EMC experience.  He has been involved with the design and construction of 8 EMC labs, including three 10-meter semi anechoic chambers within the last 6 years.  He is an active member of the U.S. Technical Advisory Group for CISPR/I and is the ITI TC5 committees on EMC.  Mr. Ray has a Bachelor of Engineering Technology degree from Wayne State University in Detroit.  Darryl is a past chair of the Santa Clara Valley EMC chapter, and is currently on the IEEE EMC2004 EMC Symposium committee serving as publicity chair.

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TBA

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