SANTA CLARA VALLEY CHAPTER OF THE IEEE EMC SOCIETY |
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2003 Monthly Chapter Meeting Notices |
� | January 14th, 2003 | "Electromagnetic Emission from "Dielectric" Optical Fiber Cables" |
� | February 11th, 2003 | "Vcc and Ground Bounce in planes and IC packages" |
� | March 11th, 2003 | "Microwave and Millimeter Wave Regulation and Measurement Techniques" |
� | April 8th, 2003 | "Design and Construction of Semi Anechoic EMC Chambers, including a open house of the new Apple Computer 10-meter chamber" |
� | May 13th, 2003 | "Considerations for Advanced EMC Design Flow" |
� | June 10th, 2003 | no meeting - off month |
� | July 8th, 2003 | no meeting - off month |
� | August 12th, 2003 | no meeting - off month |
� | September 9th, 2003 | "Our Annual Social and Business Planning Session" |
� | October 14th, 2003 | " The Dual Challenge of Electromagnetic Compliance and Environmental Compliance" |
� | November 11th, 2003 | "PCB EMC Design Guidelines: A Brief Annotated List" |
� | December 9th, 2003 | "Down Memory Lane; 30 Years of EMI Field Testing" |
Directions and Dinner Information | ||
APPLIED MATERIALS, 3090 Bowers Avenue, Santa Clara, CA. Bowers Cafe. [MAP] | ||
Archive | ||
2002 Monthly Chapter Meeting Notices | ||
Fall 2001 Monthly Chapter Meeting Notices | ||
2000/2001 Monthly Chapter Meeting Notices | ||
1999/2000 Monthly Chapter Meeting Notices | ||
1998/1999 Monthly Chapter Meeting Notices | ||
1997/1998 Monthly Chapter Meeting Notices | ||
1996/1997 Monthly Chapter Meeting Notices | ||
1995/1996 Monthly Chapter Meeting Notices | ||
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January 2003 Meeting Notice | ||
When/Where: | ||
Tuesday, January 14th, 2003. | ||
Topic/Speaker: | ||
"Electromagnetic Emission from "Dielectric" Optical Fiber Cables" - Robert Dahlgren | ||
Details: |
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The conventional wisdom is that optical fiber
is dielectric, and thus does not radiate RF emissions. |
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February 2003 Meeting Notice | ||
When/Where: | ||
Tuesday, February 11th, 2003. | ||
Topic/Speaker: | ||
"Vcc and Ground Bounce in planes and IC packages" - Mr. Ritchey | ||
Details: |
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Mr. Ritchey will be
speaking on the topic of Vcc and Ground Bounce in planes and IC packages and
how it may be the cause of radiated and conducted emission problems from the
enclosure and cables of your product. He will show us how using Hyperlynx
will help to see what the emissions spectra looks like for these kinds of
problems and what you may choose to do about it. He will also be sharing
some of the most popular rules of thumb that we often hear about from our
peers, such as right angle bends, vias, bypass capacitors, etc. Mr. Ritchey will be using a combination of PowerPoint and the application used in hardware design known as Hyperlynx.
About the Presenter: |
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March 2003 Meeting Notice | ||
When/Where: | ||
Tuesday, March 11th, 2003. | ||
Topic/Speaker: | ||
"Microwave and Millimeter Wave Regulation and Measurement Techniques" | ||
Details: |
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Manufacturers
producing transmitting devices operating above 30 GHz must meet FCC dictated
levels for the suppression of radiated spurious and harmonic emissions.
Of specific interest are the suppression criteria encompassing the frequency range of 110 to 230 GHz. Ignoring the illogic of having regulations requiring measurement at frequencies where no reference standards exists, some data must be produced to secure the "certification" necessary to bring the product to market. Measurement techniques, that have been successfully used to obtain certification, are available and can be employed with reasonable effort and expense. Techniques for addressing the ISO requirement of testing the test system at these frequencies have also been developed. When approaching these measurement tasks some mental adjustment is required on the engineer's part. These techniques and mental adjustments are discussed. The impact of recent advances in millimeter wave measurement technology will also be explored.
About the Presenter: |
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April 2003 Meeting Notice | ||
When/Where: | ||
Tuesday, April 8th, 2003. | ||
Topic/Speaker: | ||
"Design and
Construction of Semi Anechoic EMC Chambers, including a open house of the
new Apple Computer 10-meter chamber" |
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Details: |
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The design,
procurement, and construction of a modern EMC chamber can be tricky business
there are many factors to consider. Although chamber manufacturers
offer a "Turnkey" solution, it is best to customize the design towards the
users particular needs. This presentation will review various deign
considerations including performance, features & suggested interfaces for
testing ITE products. Advice on how to purchase a chamber and an
overview the construction headaches often encountered will also be
presented. The presentation will conclude with a brief photo session
of the construction of the new Apple EMC lab.
After the presentation, an open house will be held at the new 10-meter Apple chamber. The open house will take place from 8:15 PM to 9:15 PM. The chamber is located at 123 E. Evelyn, Mountain View, CA. Directions and parking information will be announced at the meeting.
About the Presenter: |
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May 2003 Meeting Notice | ||
When/Where: | ||
Tuesday, May 13th, 2003. | ||
Topic/Speaker: | ||
"Considerations for Advanced EMC Design Flow" - Sudip Das | ||
Details: |
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In an ideal
world, every hardware project should have a engineer responsible for
functional design, regulatory compliance, signal integrity (SI), CAD, and
manufacturing. Each of them would get ample time to thoroughly check
and simulate their portions of the design. But in the real world, we
are often faced with a lack of both time and resources. What can be done to
make our design process effective, even in very fast-paced projects, so that
none of the design objectives are overlooked? Another challenge would
be: how to introduce this new process without breaking down the existing
legacy process? And, of course, how and where does EMC fit in this
overall process flow? One approach would be to embed the design
requirements in the CAD tools, and by efficiently designing the schematics
and PCB layout to preserve the compliance and SI knowledge-base from one
project to another.
About the Presenter: |
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September 2003 Meeting Notice | ||
When/Where: | ||
Tuesday, September 9th, 2003. | ||
Topic/Speaker: | ||
"Our Annual Social and Business Planning Session" | ||
Details: |
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The Santa Clara
Valley EMC Society Chapter invites all EMC society members and prospective
members to attend our annual kickoff season social on Tuesday, 9 September
2003. The social will start at 5:30 PM and continue until 8:30 PM. The purpose of this event is to promote interaction and discussion about useful topics for the technical sessions to be held during the 2003-2004 season, and to have a good time. This is the opportune time to trade summer vacation stories, find out who is working where, who might have an opening in their company, as well as visiting with your peers again after the summer. The chapter also invites prospective speakers to attend this session and submit their presentation for consideration. Suggested topics include: measurements (techniques, technology, problems, corrections, calibration); test facilities (shielded rooms, open field test sites, screen rooms, anechoic and semi-anechoic chambers); EM noise sources and studies; design for reduced noise; ESD; antennas and propagation; EMC standards and regulations; EMC and Signal Integrity issues, wireless topics, and computer aided analysis and design. Anyone interested in presenting an outline of these or other appropriate topics should contact any of the Chapter ADCOM members here or at the meeting. |
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October 2003 Meeting Notice | ||
When/Where: | ||
Tuesday, October 14th, 2003. | ||
Topic/Speaker: | ||
" The Dual Challenge of Electromagnetic Compliance and Environmental Compliance" - Dr. Rocky R. Arnold | ||
Details: |
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OEMs and their design teams face a myriad of increasingly difficult challenges when it comes to rapidly and effectively accomplishing new product development (NPD). Choices made by the team at the onset of conceptual and prototype design strongly influence the ability of the final product to be compliant with respect to EMC. Compounding the problem of EMC is the increasing importance of environmental compliance. With the advent of regulations that prevent the use of lead in electronic devices, soldered components, including metal cans, will face higher prices as methods to remove metal cans for recycling purposes must be developed. The presentation will focus on alternative methods of achieving both EMC and environmental compliance.
About the Presenter: Dr. Arnold received his M.S. and Ph.D. in Civil Engineering (emphasis Structural Mechanics) from Stanford University in 1980 and 1983 respectively. He received his M.S. in Mechanical Engineering (emphasis wave propagation and acoustics) from the Massachusetts Institute of Technology in 1972. He graduated from the University of Missouri (Rolla) in Mechanical Engineering in 1970. He also has an MBA from Notre Dame de Namur (1993). |
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November 2003 Meeting Notice | ||
When/Where: | - PRESENTATION | |
Tuesday, November 11th, 2003. | ||
Topic/Speaker: | ||
"PCB EMC Design Guidelines: A Brief Annotated List" - Prof. Todd Hubing University of Missouri-Rolla (UMR) | ||
Details: |
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Some of the worst printed circuit board design
choices are made by engineers who are trying to comply with a list of EMC
design guidelines. At the University of Missouri-Rolla, students working
with a list of 40 "good" EMC design guidelines tend to produce board layouts
that are worse than layouts produced by students with no access to
guidelines. Nevertheless, a short prioritized list of design guidelines can
be helpful at times. This presentation reviews some of the more general EMC
design guidelines for printed circuit board layout and attempts to
categorize them as good, bad or indifferent.
About the Presenter: From 1982 to 1989, he was employed in the Electromagnetic Compatibility Laboratory, IBM Communications Products Division, in Research Triangle Park, NC. In 1989, he decided that he wanted to spend less time fixing EMC problems and more time trying to understand them, so he left IBM to join the faculty at the University of Missouri-Rolla (UMR). He is currently a Professor of Electrical and Computer Engineering at UMR and part of a team of faculty and students working to solve a wide range of EMC problems affecting the electronics industry. Prof. Hubing teaches the "Grounding and Shielding" and "High-Speed Digital Design" courses at UMR, where he has received several awards for teaching and faculty excellence. He's been an associate editor of the IEEE Transactions on EMC and the Journal of the Applied Computational Electromagnetics Society. He is currently the President of the IEEE EMC Society. |
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December 2003 Meeting Notice | ||
When/Where: | ||
Tuesday, December 9th, 2003. | ||
Topic/Speaker: | ||
"Down Memory Lane; 30 Years of EMI Field Testing" - William H. "Bill" Parker, PE, NCE, PARKER EMC ENGINEERING | ||
Details: |
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Mr. Parker will present an overview of his EMI field testing experiences, which will include military, commercial, medical, and aerospace test samples, for both emissions and susceptibility, from 1973 to the present. Test locations were in California, Nevada, Arizona, Washington, Montana, Idaho, Alaska, and Louisiana. He will discuss common field testing problems, solutions, and "significant unplanned occurrences." Test samples included engine-generators, motor-generators, uninterrupted power systems, medical diagnostic equipment, airplanes, the space shuttle Challenger, and a Navy submarine. Test sites included military bases, remote radar sites, hospitals, broadcast studios, and airports. Site conditions ranged from hot to frigid, dusty and dry to heavy downpours, and included several blizzards. Travel modes included company van, rental cars, commercial airlines, bush planes, and private airplane. Mr. Parker will end with a discussion of significant lessons learned.
About the Presenter: |
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Meeting Location: Applied Materials Bowers Cafe, 3090 Bowers Avenue, Santa
Clara, CA |
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