SANTA CLARA VALLEY CHAPTER OF THE IEEE EMC SOCIETY

                                           



2003 Monthly Chapter Meeting Notices
January 14th, 2003 "Electromagnetic Emission from "Dielectric" Optical Fiber Cables"
February 11th, 2003 "Vcc and Ground Bounce in planes and IC packages"
March 11th, 2003 "Microwave and Millimeter Wave Regulation and Measurement Techniques"
April 8th, 2003 "Design and Construction of Semi Anechoic EMC Chambers, including a open house of the new Apple Computer 10-meter chamber"
May 13th, 2003 "Considerations for Advanced EMC Design Flow"
June 10th, 2003 no meeting - off month
July 8th, 2003 no meeting - off month
August 12th, 2003 no meeting - off month
September 9th, 2003 "Our Annual Social and Business Planning Session"
October 14th, 2003 " The Dual Challenge of Electromagnetic Compliance and Environmental Compliance"
November 11th, 2003 "PCB EMC Design Guidelines: A Brief Annotated List"
December 9th, 2003 "Down Memory Lane; 30 Years of EMI Field Testing"
Directions and Dinner Information
APPLIED MATERIALS, 3090 Bowers Avenue, Santa Clara, CA. Bowers Cafe.  [MAP]
Archive
2002 Monthly Chapter Meeting Notices
Fall 2001 Monthly Chapter Meeting Notices
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1999/2000 Monthly Chapter Meeting Notices
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1996/1997 Monthly Chapter Meeting Notices
1995/1996 Monthly Chapter Meeting Notices
 

January 2003 Meeting Notice
When/Where:
Tuesday, January 14th, 2003.  
Topic/Speaker:
"Electromagnetic Emission from "Dielectric" Optical Fiber Cables" - Robert Dahlgren  
Details:

[ TOP ]

The conventional wisdom is that optical fiber is dielectric, and thus does not radiate RF emissions.
In practice, optical fiber cable connectors have non-negligible amounts of conductive material, for example a ferrule, spring, and crimp ring. As data rates have increased beyond 1 gigabit/second
(Gbps), equipment with supposedly "RF tight" enclosures exhibited high levels of RF emissions, failing
to meet FCC/European electromagnetic compliance (EMC) requirements. It is hypothesized that these small metallic bits can re-radiate RF emissions due to capacitive coupling, and a model is proposed. Data is presented to support this mechanism for RF emission, and corrective measures are suggested to reduce these emissions.

About the Presenter:
Robert Dahlgren
is President of Silicon Valley Photonics Ltd., a consultancy in advanced optical technology. He has been working in optical technology for more than 20 years. He has previously been employed at Honeywell,
Control Data, Sperry Aerospace, the Charles Stark Draper Laboratory, Transcendata, and Fujikura Technology. He has worked on diverse areas of optical R&D and engineering, such as microlithography, metrology, passive
fiber devices, sensors, avionics, communication transceivers, physics, nuclear testing, and data communications. He is the author of more than ten patents and numerous technical publications, and is a recipient of the IEEE
"3rd Millennium" award. He is active in several optical professional societies, and is the chairman-emeritus of the award-winning Santa Clara Valley chapter of the IEEE Lasers & Electro-Optics Society. He received his
M.S. degree from M.I.T in aeronautics/astronautics in 1993, his second M.S. degree from San Jose State University in physics in 2001, and his B.S.E.E. from the University of Minnesota in 1983.


February 2003 Meeting Notice
When/Where:
Tuesday, February 11th, 2003.  
Topic/Speaker:
"Vcc and Ground Bounce in planes and IC packages" - Mr. Ritchey  
Details:

[ TOP ]

Mr. Ritchey will be speaking on the topic of Vcc and Ground Bounce in planes and IC packages and how it may be the cause of radiated and conducted emission problems from the enclosure and cables of your product.  He will show us how using Hyperlynx will help to see what the emissions spectra looks like for these kinds of problems and what you may choose to do about it.  He will also be sharing some of the most popular rules of thumb that we often hear about from our peers, such as right angle bends, vias, bypass capacitors, etc. 

Mr. Ritchey will be using a combination of PowerPoint and the application used in hardware design known as Hyperlynx.

About the Presenter:
Lee Ritchey, BSEE, is owner of Speeding Edge, a consulting firm specializing in high-speed design consulting and training.  Prior to forming Speeding Edge, Mr. Ritchey spent five years as Director of Electronic Packaging Engineering at 3Com Corporation, a major manufacturer of high performance networking equipment.  For ten years prior to that, he was a cofounder and Vice President of Engineering at Shared Resources, a company that specialized in the design of high performance printed circuit boards for the supercomputing industry.  He has more than 30 years experience in the packaging of high performance equipment ranging from microwave satellites to super computers.  He is currently working with major suppliers of gigabit and beyond internet products as well as a variety of wireless products.  Mr. Ritchey has been on the editorial review board for Printed Circuit Design Magazine and is a regular contributor of design articles to a variety of publications.  He has taught his High Speed Design course to more than 3000 engineers and designers in several countries.  He is a regular lecturer at the Printed Circuit Design Conference, the IPC conferences and at UC Berkeley Engineering Extension.


March 2003 Meeting Notice
When/Where:
Tuesday, March 11th, 2003.  
Topic/Speaker:
"Microwave and Millimeter Wave Regulation and Measurement Techniques"
Details:

[ TOP ]

Manufacturers producing transmitting devices operating above 30 GHz must meet FCC dictated levels for the suppression of radiated spurious and harmonic emissions.  Of specific interest are the suppression criteria
encompassing the frequency range of 110 to 230 GHz.  Ignoring the illogic of having regulations requiring
measurement at frequencies where no reference standards exists, some data must be produced to secure the
"certification" necessary to bring the product to market.  Measurement techniques, that have been successfully used to obtain certification, are available and can be employed with reasonable effort and expense.  Techniques for addressing the ISO requirement of testing the test system at these frequencies have also been developed.  When approaching these
measurement tasks some mental adjustment is required on the engineer's part.  These techniques and mental adjustments are discussed.  The impact of recent advances in millimeter wave measurement technology will also be explored.

About the Presenter:
Chuck Oleson is the owner of Oleson Microwave Labs, Morgan Hill, CA., a manufacturer of millimeter wave test equipment covering 18 to 325 GHz.  He has been involved in millimeter wave technology for more than 19 years and in RF and microwave technology for 36 years.  He has been previously employed for 11 years by Varian Associates in positions including sales and marketing management and engineering management.  He has authored numerous papers covering microwave and millimeter wave technologies.  He is a member of the IEEE and a graduate of Cal Poly State University, San Luis Obispo, CA.

 

April 2003 Meeting Notice
When/Where:
Tuesday, April 8th, 2003.  
Topic/Speaker:
"Design and Construction of Semi Anechoic EMC Chambers, including a open house of the new Apple Computer
10-meter chamber"
Details:

[ TOP ]

The design, procurement, and construction of a modern EMC chamber can be tricky business there are many factors to consider.  Although chamber manufacturers offer a "Turnkey" solution, it is best to customize the design towards the users particular needs.  This presentation will review various deign considerations including performance, features & suggested interfaces for testing ITE products.  Advice on how to purchase a chamber and an overview the construction headaches often encountered will also be presented.  The presentation will conclude with a brief photo session of the construction of the new Apple EMC lab. 

After the presentation, an open house will be held at the new 10-meter Apple chamber.  The open house will take place from 8:15 PM to 9:15 PM. The chamber is located at 123 E. Evelyn, Mountain View, CA. Directions and parking information will be announced at the meeting.

About the Presenter:
Darryl Ray is a senior EMC engineer at Apple Computer, in charge of the EMC compliance for the server and high-end desktop product line.  He is a Senior Member of the IEEE with more than 20 years EMC experience.  He has been involved with the design and construction of 8 EMC labs, including three 10-meter semi anechoic chambers within the last 6 years.  He is an active member of the U.S. Technical Advisory Group for CISPR/I and is the ITI TC5 committees on EMC.  Mr. Ray has a Bachelor of Engineering Technology degree from Wayne State University in Detroit.  Darryl is a past chair of the Santa Clara Valley EMC chapter, and is currently on the IEEE EMC2004 EMC Symposium committee serving as publicity chair.


May 2003 Meeting Notice
When/Where:
Tuesday, May 13th, 2003.  
Topic/Speaker:
"Considerations for Advanced EMC Design Flow" - Sudip Das
Details:

[ TOP ]

In an ideal world, every hardware project should have a engineer responsible for functional design, regulatory compliance, signal integrity (SI), CAD, and manufacturing.  Each of them would get ample time to thoroughly check and simulate their portions of the design.  But in the real world, we are often faced with a lack of both time and resources. What can be done to make our design process effective, even in very fast-paced projects, so that none of the design objectives are overlooked?  Another challenge would be: how to introduce this new process without breaking down the existing legacy process?  And, of course, how and where does EMC fit in this overall process flow?  One approach would be to embed the design requirements in the CAD tools, and by efficiently designing the schematics and PCB layout to preserve the compliance and SI knowledge-base from one project to another.

About the Presenter:
Sudip Das
is an EMC engineer at Cisco systems. He has been working as an EMC engineer for the last eight years. Before joining Cisco Systems, he was previously employed at Sun Microsystems. His primary focus areas are EMC, CAD design and SI, and overall hardware design process flow. He has worked with various type of products starting from high end super computers to low end ultra-cost sensitive home office products using offshore companies. He has authored several papers in IEEE EMC journals. He received his Ph. D and MS degree in Electrical Engineering from University of Kentucky and B.Tech in Electronics from IIT Kharagpur, India.


September 2003 Meeting Notice
When/Where:
Tuesday, September 9th, 2003.  
Topic/Speaker:
"Our Annual Social and Business Planning Session"
Details:

[ TOP ]

The Santa Clara Valley EMC Society Chapter invites all EMC society members and prospective members to attend our annual kickoff season social on Tuesday, 9 September 2003.  The social will start at 5:30 PM and continue until 8:30 PM. 

The purpose of this event is to promote interaction and discussion about useful topics for the technical sessions to be held during the 2003-2004 season, and to have a good time.  This is the opportune time to trade summer vacation stories, find out who is working where, who might have an opening in their company, as well as visiting with your peers again after the summer. 

The chapter also invites prospective speakers to attend this session and submit their presentation for consideration.  Suggested topics include: measurements (techniques, technology, problems, corrections, calibration); test facilities (shielded rooms, open field test sites, screen rooms, anechoic and semi-anechoic chambers); EM noise sources and studies; design for reduced noise; ESD; antennas and propagation; EMC standards and regulations; EMC and Signal Integrity issues, wireless topics, and computer aided analysis and design.

Anyone interested in presenting an outline of these or other appropriate topics should contact any of the Chapter ADCOM members here or at the meeting.

October 2003 Meeting Notice
When/Where:
Tuesday, October 14th, 2003.  
Topic/Speaker:
" The Dual Challenge of Electromagnetic Compliance and Environmental Compliance" - Dr. Rocky R. Arnold
Details:

[ TOP ]

OEMs and their design teams face a myriad of increasingly difficult challenges when it comes to rapidly and effectively accomplishing new product development (NPD).   Choices made by the team at the onset of conceptual and prototype design strongly influence the ability of the final product to be compliant with respect to EMC.  Compounding the problem of EMC is the increasing importance of environmental compliance.  With the advent of regulations that prevent the use of lead in electronic devices, soldered components, including metal cans, will face higher prices as methods to remove metal cans for recycling purposes must be developed.  The presentation will focus on alternative methods of achieving both EMC and environmental compliance.

About the Presenter:
Dr. Rocky R. Arnold is Founder, President and CEO of WaveZero, Inc. (Sunnyvale, CA) launched in 2000.  Since 1994, he has been involved in technology start-up funding and enterprise management.  Working for a Sunnyvale electronic products design firm he led the RF design team, held the position of Director, Business Development and was instrumental in developing the firm's strategic position that lead to their
acquisition by a public company in 1998.  Prior to 1994, he created an R&D department for a small business and secured, as a Principal Investigator, over 20 Phase I/II/III Small Business Innovation Research (SBIR) awards.  He was been the Principal Investigator on three U.S. Army SBIR projects involving EMI/EMP protective structures and gaskets made from conductive polymer materials. He has authored over 50 technical and scientific reports and numerous papers involving composite materials, structures and EMI shielding.

Dr. Arnold received his M.S. and Ph.D. in Civil Engineering (emphasis Structural Mechanics) from Stanford University in 1980 and 1983 respectively.  He received his M.S. in Mechanical Engineering (emphasis wave propagation and acoustics) from the Massachusetts Institute of Technology in 1972.  He graduated from the University of Missouri (Rolla) in Mechanical Engineering in 1970.  He also has an MBA from Notre Dame de Namur (1993).


November 2003 Meeting Notice
When/Where: - PRESENTATION
Tuesday, November 11th, 2003.
Topic/Speaker:
"PCB EMC Design Guidelines: A Brief Annotated List" - Prof. Todd Hubing University of Missouri-Rolla (UMR)
Details:

[ TOP ]

Some of the worst printed circuit board design choices are made by engineers who are trying to comply with a list of EMC design guidelines. At the University of Missouri-Rolla, students working with a list of 40 "good" EMC design guidelines tend to produce board layouts that are worse than layouts produced by students with no access to guidelines. Nevertheless, a short prioritized list of design guidelines can be helpful at times. This presentation reviews some of the more general EMC design guidelines for printed circuit board layout and attempts to categorize them as good, bad or indifferent.

About the Presenter:
Todd Hubing received his B.S.E.E. degree from the Massachusetts Institute of Technology in 1980, his M.S.E.E. degree from Purdue University in 1982, and his Ph.D. in Electrical Engineering from North Carolina State University in 1988.

From 1982 to 1989, he was employed in the Electromagnetic Compatibility Laboratory, IBM Communications Products Division, in Research Triangle Park, NC. In 1989, he decided that he wanted to spend less time fixing EMC problems and more time trying to understand them, so he left IBM to join the faculty at the University of Missouri-Rolla (UMR). He is currently a Professor of Electrical and Computer Engineering at UMR and part of a team of faculty and students working to solve a wide range of EMC problems affecting the electronics industry.

Prof. Hubing teaches the "Grounding and Shielding" and "High-Speed Digital Design" courses at UMR, where he has received several awards for teaching and faculty excellence. He's been an associate editor of the IEEE Transactions on EMC and the Journal of the Applied Computational Electromagnetics Society. He is currently the President of the IEEE EMC Society.


December 2003 Meeting Notice
When/Where:
Tuesday, December 9th, 2003.
Topic/Speaker:
"Down Memory Lane; 30 Years of EMI Field Testing" - William H. "Bill" Parker, PE, NCE, PARKER EMC ENGINEERING
Details:

[ TOP ]

Mr. Parker will present an overview of his EMI field testing experiences, which will include military, commercial, medical, and aerospace test samples, for both emissions and susceptibility, from 1973 to the present. Test locations were in California, Nevada, Arizona, Washington, Montana, Idaho, Alaska, and Louisiana. He will discuss common field testing problems, solutions, and "significant unplanned occurrences." Test samples included engine-generators, motor-generators, uninterrupted power systems, medical diagnostic equipment, airplanes, the space shuttle Challenger, and a Navy submarine. Test sites included military bases, remote radar sites, hospitals, broadcast studios, and airports. Site conditions ranged from hot to frigid, dusty and dry to heavy downpours, and included several blizzards. Travel modes included company van, rental cars, commercial airlines, bush planes, and private airplane. Mr. Parker will end with a discussion of significant lessons learned. 

About the Presenter:
Bill Parker has owned and operated Parker EMC Engineering since he founded it in 1989. He served in the U.S. Army from 1965 - 1969, and graduated from North Carolina State University in 1973. He began work as an EMC engineer at Genisco Technology Corporation that same year, under the tutelage of Steve Jensen. At Genisco, Bill had varied assignments, including powerline filter design, EMI lab testing, EMI lab supervision, EMI field-testing, EMC consulting, and departmental management. In 1988, he was promoted to Director of Engineering at Genisco. In 1989, he resigned to start his current EMC consulting business. Bill has also taught EMC seminars since 1982, and has provided consulting, testing, or teaching services throughout the USA, and in eight foreign countries. He is a Registered Professional Electrical Engineer in California, a NARTE Certified EMC engineer, a Senior Member of the IEEE, and a Past Vice President, Board Member, and Distinguished Lecturer of the IEEE EMC Society.


 Meeting Location: Applied Materials Bowers Cafe, 3090 Bowers Avenue, Santa Clara, CA  New Meeting Location


 

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