2019 Meetings

The linked titles of some meetings are the presentations speakers provided.


May 7, 2019: " Navigating Compliance in the BRIC Marketplace" Mark Maynard

Abstract: The consumer markets in Brazil, Russia, India and China (BRIC) now are responsible for a sizable portion of the profits for most global companies. Working against this prize is a formidable maze of culture, laws, and overlapping regulations, causing confusion surrounding the regulatory requirements. If you are considering entering the BRIC marketplace with your electrical and electronic products, you need knowledge of how to obtain the necessary regulatory approvals for EMC, telecom, and product safety. Whether your product is for telecommunications, computing, wireless, consumer electronics, or household appliances, you will face some distinct and unique obstacles, for which you need to be prepared. Distance, language, unfamiliar culture, and developing market conditions can make this a difficult and expensive procedure for the uninformed. Come to this presentation so you can gain some insight into the processes, and learn sources of information and allies to help you navigate a safe path to compliance.

Bio: Mark Maynard has over 25 years of experience in compliance engineering, in the areas of EMC/EMI, wireless/telecom, product safety, environmental, and quality management systems. He also served as the President-Elect for the IEEE Product Safety Engineering Society, and was the Exhibitions Chair for the 2017 IEEE EMC Symposium. Mark can be reached at mmaynard@ieee.org

April 16, 2019: " Interference between RF Device Modeling and Best Practices for using CAD Information in 3D Simulation of Electromagnetic Effects " Timothy McDonald & Matt Miller

Abstract: Interference between RF devices is one of the biggest challenges in designing and maintaining commercial and defense systems. These systems include ships, airplanes, drones, cell phones, satellites, automobiles and generally, anything that has RF systems installed in or on it. The problem is complex for a number of reasons including the broadband nature of the interference, the lack of detailed performance data, introduction of intermodulation products when multiple systems interact with one another and a host of other reasons. Identifying and solving cosite interference issues early in a design is critical as discovering an interference problem right before bringing a product to market or after it has been put into service can cost millions of dollars to fix the problem and lost revenue. One only has to perform a web search for “cosite interference” to see a sample of the issues that have plagued military and commercial programs for decades. In this talk, we will discuss the analysis capabilities and approach that EMA employs to predict and mitigate RF cosite interference problems for our customers. Today, EM engineers must use 3D geometry in a practical way in their work without letting the complexity of handling the full CAD overwhelm their design cycles. EM effects teams must do more in an increasingly shorter period, while being required to work on models traceable to the master CAD. As the ability to model ever-larger scenarios with 3D computational electromagnetic (CEM) codes emerges as a possibility, the main limitation is preparing the geometrical models received from mechanical drawings in PLM systems in a timely manner. This talk will talk about best practices to develop EM models that can have an impact on product design in EM effects. We will discuss common scenarios for aircraft, spacecraft and automobiles and how modern EM effects teams can leverage simulation to reduce the design cycle and achieve product validation.

Tim McDonald

Bio: Tim McDonald, PhD is chief scientist at Electro Magnetic Applications where he has implemented new system-modeling approaches to simulate the interaction of systems and their electronics with electromagnetic environments in a shorter time, with more accuracy, and at a lower cost. He is a consultant to NASA and DoD major primes for specialty engineering of critical systems, development of novel materials solutions to EMI/EMC problems, and in the execution of major programs that require verification to electromagnetic environmental effects.

Matt Miller

Bio: Matt Miller is a Senior Scientist at Electro Magnetic Applications (EMA) where he leads a group providing analysis services for cosite interference, installed antenna performance and radar signature prediction. Mr. Miller has over 20 years of experience in electromagnetics, business development, marketing and sales. In 2005, Mr. Miller co-founded Delcross Technologies, LLC where he served as the President. Delcross developed commercial simulation tools for cosite interference, installed antenna performance and radar signature prediction. In 2015, Delcross was sold to ANSYS, Inc.

March 12, 2019: " Automated Design Rule Check for EMC Design" Federico Centola

Abstract: The EMC design of PCBs often requires board reviews and inspections to insure that EMC guidelines are followed and that are no major EMC design violations. This review process is very often a manual process, time consuming and prone to errors especially when large PCB with multiple layers have to be examined. Automated Design Rule Checking (DRC) tools have been available for years but are not always used because the set-up time may also be very time consuming and because the results usually contain many non-critical violations. This presentation discusses the utility of DRC for EMC, possible ways of automating the process and the importance of having customized rules and design parameters.

Bio: Federico Centola received his Laurea degree in electrical engineering from the University of L'Aquila, Italy and the M.S. degree in electrical engineering in 2003 from the Missouri Science and Technology University. After his graduation he has worked for 5 years as Senior Application Engineer and Associate Line of Business Manager for Flomerics, a company that specialized in Electromagnetic numerical simulations using the 3D Transmission Line Matrix method. For 9 years he has been an EM Technologist at Apple. In the technology group, he developed design methodologies and tools for the Apple EMC and EM Design groups. He worked on iPhones, iPads, Apple Watches and different iMac products. Since 2017, he has joined the Platform group at Google where he works as a Lead EMC Designer. Federico Centola has authored or co-authored a number of papers and patents. Numerous times he has been an invited speaker at IEEE conferences and he has been serving for many year as reviewer for the IEEE Transaction on EMC.

February 05, 2019: Advances in Automotive Design and Test for EMC and Wireless Applications


"Two Common PCB Layout Errors that Cause Automotive Products to Fail to Meet EMC Requirements " Todd Hubing

It is possible to design and build automotive components and systems that consistently meet their EMC requirements on the first test pass. In fact, this is the norm at several automotive companies. Nevertheless, many automotive products do not meet all of their EMC requirements on the first test pass. Patching and tweaking these designs to be compliant can result in products that are less robust and more expensive than they need to be. Automotive products that fail to meet their EMC requirements generally fall into two categories: products with poorly laid-out boards and products with well laid-out boards that have one or two critical errors. This presentation describes two common PCB layout errors that, in the author’s experience, are most likely to cause an otherwise good automotive design to fail to meet its EMC requirements.

" EMC and Wireless Test and Measurement: Challenges and Solutions for Connected Vehicles " Garth D’Abreu

In the rapidly evolving industry of autonomous, electric and hybrid vehicles, the ability to successfully provide vehicle level antenna pattern measurements as well as EMC measurements to verify the performance of Advanced Driver Assistance Systems (ADAS) will be key to the future of this market and address public safety concerns. The automotive trends in wireless capabilities for high data streaming, incident detection warning, anti-collision/adaptive cruise control radar, wireless entry and vehicle-to-vehicle (V2V), vehicle-to-infrastructure (V2I) and vehicle-to-cloud (V2C) communication are just a few of the features impacting the functionality of today’s modern vehicles. This presentation details the challenges presented by these market demands and how innovative testing solutions help drive the technologies forward to real-life applications.

Todd Hubing

Bio: Dr. Todd Hubing is a Professor Emeritus of Electrical and Computer Engineering at Clemson University and President of LearnEMC. LearnEMC provides EMC instruction, consulting and design assistance to engineers working in the automotive, aerospace and consumer electronics industries. Dr. Hubing holds a BSEE degree from MIT, an MSEE degree from Purdue University and a Ph.D. from North Carolina State University. He was an engineer at IBM for 7 years and a faculty member at the University of Missouri-Rolla for 17 years before joining Clemson University in 2006. As the Michelin Professor of Vehicle Electronics at Clemson, he directed research in the Clemson Vehicular Electronics Laboratory and taught classes in vehicle electronics, electromagnetic compatibility and digital signal integrity. Dr. Hubing has authored or co-authored over 200 papers and presentations on electromagnetic modeling, electromagnetic compatibility and the design of reliable electronic systems. He is a Fellow of the Institute of Electrical and Electronics Engineers (IEEE), a Fellow of the Applied Computational Electromagnetics Society, and a Past-President of the IEEE Electromagnetic Compatibility Society.

Garth D’Abreu

Bio: Mr. Garth D’Abreu is the Director, Automotive Solutions at ETS-Lindgren based at the corporate headquarters office in Cedar Park, Texas. He has primary responsibility for the design and development functions worldwide within the Systems Engineering group, specializing in turnkey solutions for Automotive EMC and Wireless test integration. Some of these more complex full vehicle and electronic sub-assembly (ESA) test chambers involve his coordination with the RF engineering team on custom components, and the certified, internal Building Information Modeling (BIM) team at ETS-Lindgren. Due to his considerable industry experience, he is the ETS-Lindgren global subject matter expert responsible for the ongoing research and development of Automotive EMC/Wireless test chambers for Regular, Autonomous, Electric and Hybrid Electric Vehicles, focusing on combination anechoic chambers, reverberation chambers, GTEM cells, EMP protection applications and wireless device (antenna measurement) test systems. Mr. D’Abreu is a member of the IEEE EMC Society and active participant in standards development, including the SAE, ISO and CISPR D automotive EMC standards, with over 25 years of experience in the RF industry. He holds a BSc degree in Electronics & Communications Engineering, from North London University, UK.

January 08, 2019: " The case for measurement and analysis of ESD fields in semi-conductor manufacturing" Timothy Maloney

Abstract: A destructive Charged Device Model electrostatic discharge event can happen in semiconductor manufacturing and should be detectable from radiation that results from collapse of an electric dipole. The analytically describable radiation field pulse of CDM can be readily produced with a new instrument (CDM Event Simulator or CDMES) that creates dipole collapse at will. A coaxial monopole E-field antenna’s transfer function gives the antenna signal in near-field, and experiments compare well with theory. These and other instruments for CDM ESD monitoring and process control are described in a newly-issued patent, reviewed here.

Bio: Timothy J. Maloney received an S.B. degree in physics from the Massachusetts Institute of Technology in 1971, an M.S. in physics from Cornell University in 1973, and a Ph.D. in electrical engineering from Cornell in 1976, where he was a National Science Foundation Fellow. He was a Postdoctoral Associate at Cornell until 1977, when he joined the Central Research Laboratory of Varian Associates, Palo Alto, CA. At Varian until 1984, he worked on III-V semiconductor photocathodes, solar cells and microwave devices, as well as silicon molecular beam epitaxy and MOS process technology. Since 1984 he was with Intel Corp., Santa Clara, CA, where he was concerned with integrated circuit electrostatic discharge (ESD) protection, CMOS latchup testing, fab process reliability, signal integrity, system ESD testing, and design and testing of standard IC layouts. He was a Senior Principal Engineer at Intel from 1999 until retirement in June of 2016. He received the Intel Achievement Award for his patented ESD protection devices, which have achieved breakthrough ESD performance enhancements for a wide variety of Intel products. He now holds forty patents. Dr. Maloney received Best Paper/Outstanding Paper Awards for his contributions to the EOS/ESD Symposium in 1986, 1990, and 2015, was General Chairman for the 1992 EOS/ESD Symposium, and received the ESD Association's Outstanding Contributions Award in 1995. He has taught short courses at UCLA, University of Wisconsin, and UC Berkeley. He is co-author of a book, "Basic ESD and I/O Design" (Wiley, 1998), and is a Fellow of the IEEE. Dr. Maloney’s ESD publication web site can be found at this location.