2019 Meetings

The linked titles of some meetings are the presentations speakers provided.

February 05, 2019: Advances in Automotive Design and Test for EMC and Wireless Applications

Abstract:

"Two Common PCB Layout Errors that Cause Automotive Products to Fail to Meet EMC Requirements " Todd Hubing

It is possible to design and build automotive components and systems that consistently meet their EMC requirements on the first test pass. In fact, this is the norm at several automotive companies. Nevertheless, many automotive products do not meet all of their EMC requirements on the first test pass. Patching and tweaking these designs to be compliant can result in products that are less robust and more expensive than they need to be. Automotive products that fail to meet their EMC requirements generally fall into two categories: products with poorly laid-out boards and products with well laid-out boards that have one or two critical errors. This presentation describes two common PCB layout errors that, in the author’s experience, are most likely to cause an otherwise good automotive design to fail to meet its EMC requirements.

" EMC and Wireless Test and Measurement: Challenges and Solutions for Connected Vehicles " Garth D’Abreu

In the rapidly evolving industry of autonomous, electric and hybrid vehicles, the ability to successfully provide vehicle level antenna pattern measurements as well as EMC measurements to verify the performance of Advanced Driver Assistance Systems (ADAS) will be key to the future of this market and address public safety concerns. The automotive trends in wireless capabilities for high data streaming, incident detection warning, anti-collision/adaptive cruise control radar, wireless entry and vehicle-to-vehicle (V2V), vehicle-to-infrastructure (V2I) and vehicle-to-cloud (V2C) communication are just a few of the features impacting the functionality of today’s modern vehicles. This presentation details the challenges presented by these market demands and how innovative testing solutions help drive the technologies forward to real-life applications.

Todd Hubing

Bio: Dr. Todd Hubing is a Professor Emeritus of Electrical and Computer Engineering at Clemson University and President of LearnEMC. LearnEMC provides EMC instruction, consulting and design assistance to engineers working in the automotive, aerospace and consumer electronics industries. Dr. Hubing holds a BSEE degree from MIT, an MSEE degree from Purdue University and a Ph.D. from North Carolina State University. He was an engineer at IBM for 7 years and a faculty member at the University of Missouri-Rolla for 17 years before joining Clemson University in 2006. As the Michelin Professor of Vehicle Electronics at Clemson, he directed research in the Clemson Vehicular Electronics Laboratory and taught classes in vehicle electronics, electromagnetic compatibility and digital signal integrity. Dr. Hubing has authored or co-authored over 200 papers and presentations on electromagnetic modeling, electromagnetic compatibility and the design of reliable electronic systems. He is a Fellow of the Institute of Electrical and Electronics Engineers (IEEE), a Fellow of the Applied Computational Electromagnetics Society, and a Past-President of the IEEE Electromagnetic Compatibility Society.

Garth D’Abreu

Bio: Mr. Garth D’Abreu is the Director, Automotive Solutions at ETS-Lindgren based at the corporate headquarters office in Cedar Park, Texas. He has primary responsibility for the design and development functions worldwide within the Systems Engineering group, specializing in turnkey solutions for Automotive EMC and Wireless test integration. Some of these more complex full vehicle and electronic sub-assembly (ESA) test chambers involve his coordination with the RF engineering team on custom components, and the certified, internal Building Information Modeling (BIM) team at ETS-Lindgren. Due to his considerable industry experience, he is the ETS-Lindgren global subject matter expert responsible for the ongoing research and development of Automotive EMC/Wireless test chambers for Regular, Autonomous, Electric and Hybrid Electric Vehicles, focusing on combination anechoic chambers, reverberation chambers, GTEM cells, EMP protection applications and wireless device (antenna measurement) test systems. Mr. D’Abreu is a member of the IEEE EMC Society and active participant in standards development, including the SAE, ISO and CISPR D automotive EMC standards, with over 25 years of experience in the RF industry. He holds a BSc degree in Electronics & Communications Engineering, from North London University, UK.

















January 08, 2019: " The case for measurement and analysis of ESD fields in semi-conductor manufacturing" Timothy Maloney

Abstract: A destructive Charged Device Model electrostatic discharge event can happen in semiconductor manufacturing and should be detectable from radiation that results from collapse of an electric dipole. The analytically describable radiation field pulse of CDM can be readily produced with a new instrument (CDM Event Simulator or CDMES) that creates dipole collapse at will. A coaxial monopole E-field antenna’s transfer function gives the antenna signal in near-field, and experiments compare well with theory. These and other instruments for CDM ESD monitoring and process control are described in a newly-issued patent, reviewed here.

Bio: Timothy J. Maloney received an S.B. degree in physics from the Massachusetts Institute of Technology in 1971, an M.S. in physics from Cornell University in 1973, and a Ph.D. in electrical engineering from Cornell in 1976, where he was a National Science Foundation Fellow. He was a Postdoctoral Associate at Cornell until 1977, when he joined the Central Research Laboratory of Varian Associates, Palo Alto, CA. At Varian until 1984, he worked on III-V semiconductor photocathodes, solar cells and microwave devices, as well as silicon molecular beam epitaxy and MOS process technology. Since 1984 he was with Intel Corp., Santa Clara, CA, where he was concerned with integrated circuit electrostatic discharge (ESD) protection, CMOS latchup testing, fab process reliability, signal integrity, system ESD testing, and design and testing of standard IC layouts. He was a Senior Principal Engineer at Intel from 1999 until retirement in June of 2016. He received the Intel Achievement Award for his patented ESD protection devices, which have achieved breakthrough ESD performance enhancements for a wide variety of Intel products. He now holds forty patents. Dr. Maloney received Best Paper/Outstanding Paper Awards for his contributions to the EOS/ESD Symposium in 1986, 1990, and 2015, was General Chairman for the 1992 EOS/ESD Symposium, and received the ESD Association's Outstanding Contributions Award in 1995. He has taught short courses at UCLA, University of Wisconsin, and UC Berkeley. He is co-author of a book, "Basic ESD and I/O Design" (Wiley, 1998), and is a Fellow of the IEEE. Dr. Maloney’s ESD publication web site can be found at this location.