2018 Meetings

The linked titles of some meetings are the presentations speakers provided.

May 15, 2018: " North American Wireless Compliance " Mark Maynard

Abstract: An overview of the electronic product compliance requirements for the three NAFTA countries of Canada, USA, and Mexico. This includes coverage of the EMC/EMI, wireless/telecom, and product safety requirements, as well as information on submitting products for approvals and online resources available from the government compliance agencies such as the FCC, ISED, IFT, NOM, and the OHSA NRTL program.

Bio: Mark is the Business Development Manager for both American Certification Body and Washington Laboratories. He is an IEEE Senior Member, an active committee member for the annual IEEE Electromagnetic Compatibility (EMC) Society Symposium, and a past-president of the IEEE Product Safety Engineering Society. He has spent over 25 years working in the Regulatory Compliance Engineering field for ITE and electronics, covering international product approvals for EMC/EMI, Wireless/Telecom, Product Safety, and Design for the Environment. Mark is a frequent contributor to In Compliance magazine, and conducting compliance engineering training has been one of his key job functions since 2013. He has two degrees from Texas State University, one in Mathematics, and the other in Business & Marketing. He makes his home in the Austin, Texas area, where he lives with his wife Lisa and his five dogs.


April 10, 2018: " Near-Field Scanning: Searching for Root Causes " Hamed Kajbaf

Abstract: Sniffer probes are conventionally used for localizing the sources of radiated emissions from electronic boards and systems. However, EMC engineers know from experience that hot areas, identified by the sniffer probes, do not necessarily correlate with radiated emissions test results. Emission source microscopy (ESM) scanning technology is a powerful tool to identify the radiated emission sources. In this scanning technology, the measurement is performed in “radiative” near-field (Fresnel) region as opposed to conventional near-field scanning which is usually performed in “reactive” near-field region. The phase-resolved measurement technique used in ESM helps with back-calculating the field to board or system surface to localize the contributing sources. This talk also covers the near-field effects of electrostatic discharge (ESD) and how near-field scanning can be used to identify root causes of ESD failures per ANSI/ESD SP14.5-2015. The correlation between IEC 61000-4-2 and ANSI/ESD SP14.5-2015 will be discussed

Bio: Hamed Kajbaf received the PhD in electrical engineering from Missouri University of Science and Technology in 2012. He has previously worked at SpaceX as EMC Design Engineer. He is currently a Principal EMC Engineer at Amber Precision Instruments, San Jose, CA. His research interests include EMC and RF instrumentation, EMC and microwave scanning systems, near-field electromagnetic measurement, and array signal acquisition/processing.




March 13, 2018: " Modern EMC Receiver Measurement Concepts " Bill Wangard

Abstract: EMC receiver architecture has evolved to integrate modern technology and this provides distinct advantages in comparison to traditional swept spectrum analyzers when making EMC emissions measurements. This presentation will discuss these advantages including pre-selection, FFT based time domain scan, and real-time spectrum analysis. Live demonstration on an EMC receiver throughout the presentation will help drive home the technical concepts presented.

Bio: Bill Wangard is the EMC Receiver, Broadband Amplifier, and EMC Software product manager at Rohde & Schwarz USA. He took an active role in working with the Tri-Services Working Group to implement FFT based Time Domain Scan within MIL-STD461G. Bill has 20+ years of RF and receiver design experience with Motorola and Rohde & Schwarz USA where he authored numerous white papers and patents.




March 06, 2018: " Antenna and EMC Measurement Test Challenges of Autonomous Vehicles: The Latest Test Methods and Standards Development Impacting the Future of the Automotive Industry " Craig Fanning, Garth D’Abreu, Robert Kado, Keith Frazier, Don Seyerle.

Abstract:

Overview on ISO/CISPR D Automotive EMC Committee Activity

Over 50 automotive EMC experts from the Americas, Europe and Asia participate on the ISO/CISPR automotive EMC standards committees. The experts represent manufacturers of automotive vehicles and components as well test and instrumentation suppliers. They are responsible for writing the standards that verify the performance and quality of products manufactured in the automotive industry. As chair of the CISPR D working group 2 committee, Craig Fanning will provide a brief overview on how these committees and working groups operate, the significant standards currently under revision, and future activity related to today’s modern vehicles.

Vehicle Level Antenna Pattern and Advanced Driver Assistance Systems (ADAS) Measurement

In the rapidly evolving industry of autonomous vehicles, the ability to successfully provide vehicle level antenna pattern and ADAS measurements will be key to the future of this market and address public safety concerns. This presentation details the essential aspects of the market demands and how innovative testing solutions help drive the technologies forward to real-life applications.

Ask the Experts Panel

Our Automotive EMC expert panelists include Don Seyerle of General Motors (GM), Keith Frazier of Ford and Robert Kado of Fiat Chrysler Automobiles (FCA).

Bio: Craig Fanning is the manager of the EMC testing department at Elite Electronic Engineering located in the greater Chicago area. As manager, Craig supervises EMC laboratory scheduling, test resource management, sector operations and business planning. He also oversees all EMC programs to ensure efficiency and customer satisfaction from scheduling through invoicing. In addition to managing the EMC lab, Craig drives Elite’s lean and process improvement efforts as well as new service development. Mr. Fanning’s area of technical specialization is in automotive, truck, and construction equipment test standards. He is an active member of the SAE EMC committees, ISO TC22/SC3/WG3 USTAG, and CISPR D USTAG Lead Technical Advisor, and CISPR/D/WG2 Convener. Craig is a member of the IEEE EMC Society and has authored several papers presented at its annual symposium. He received his BSEET engineering degree from DeVry Institute of Technology in 1986. He also has a Certificate in Business Administration and a Certificate in Lean Operations and Principals, both from University of Illinois at Chicago. Craig holds iNARTE certifications as an EMC Technician and as an EMC Accredited Test Laboratory Engineer.
Garth D’Abreu is the Director, Automotive Solutions at ETS-Lindgren based at the corporate headquarters office in Cedar Park, Texas. He has primary responsibility for the design and development functions worldwide within the Systems Engineering group, specializing in turnkey solutions for Automotive EMC and Wireless test integration. Some of these more complex full vehicle and electronic sub-assembly (ESA) test chambers involve his coordination with the RF engineering team on custom components, and the certified, internal Building Information Modeling (BIM) team at ETS-Lindgren. Due to his considerable industry experience, he is the ETS-Lindgren global subject matter expert responsible for the ongoing research and development of Automotive EMC / Wireless test chambers for Regular, Electric and Hybrid Electric Vehicles, focusing on combination anechoic chambers, reverberation chambers, GTEM cells, EMP protection applications and wireless device test systems. Mr. D’Abreu is a member of the IEEE EMC Society and active participant in standards development, including the SAE, ISO and CISPR D automotive EMC standards, with over 25 years of experience in the RF industry. He holds a BSc degree in Electronics & Communications Engineering, from North London University, UK.
Robert Kado is the Sr. Manager and Sr. Technical Fellow of EMC for Fiat Chrysler Automobiles (FCA). Robert joined FCA in 2005 and has since been providing and developing technical expertise globally for the science; overall Robert has over 18 years of experience in the field of Automotive EMC. Robert represents FCA on various national and international committees for EMC and is the Chairman of the SAE EMC Committee as well as being a United States Delegate within the field. Robert has been an active member of the IEEE EMC Society his entire career and has published multiple papers presented at various symposiums. Robert obtained his BSEE and MSEE from Oakland University.
Keith Frazier received his BS in electrical engineering from Purdue University in 1976. He has been a practicing EMC engineer for over 40 years with experience in automotive, military, aerospace and commercial electronics with emphasis on system design and testing with respect to EMI and TEMPEST disciplines. Keith joined Ford Motor Company in 1990 and serves as Ford’s technical leader responsible for oversite of core EMC systems design for Ford automotive products worldwide, in addition to the development of global corporate EMC requirements and test methods. He is also an active member of the US Technical Advisory Group supporting ISO and CISPR automotive standards development. Keith has been a member of IEEE EMC Society since 1983 and has authored or co-authored multiple papers presented at past EMC symposia.
Don Seyerle is the Technical Fellow of EMC for General Motors Company. He joined GM in 1979 as a Co-Op engineering student working at one of its allied divisions, Packard Electric. Following his graduation in 1984, he transferred to the GM Milford Proving Ground EMC facility. During his 38+ year career in EMC at GM, he has been responsible for all aspects of EMC for the automobile, including vehicle EMC test automation and troubleshooting, component EMC methods and requirements development, and circuit board EMC design reviews and troubleshooting. Additionally, he represents General Motors on the various SAE EMC committees and its sub-committees, as well as serving as both a Lead US Delegate and US Expert to the international automotive EMC standardization activities (ISO TC22/SC32/WG3 and IEC CISPR/D). Donald obtained his BSEE from General Motors Institute (now known as Kettering University) and MSEE from University of Michigan.


February 13, 2018: " Future of EMC testing in components, IoT and Automotive industry " Sangam Baligar

Abstract: Can you imagine the world without Electronic devices? Today’s electronic gadgets, machines and appliances have become an integral part of our lives. The more electronic devices that these technologies (e.g. 5G & IoT) interact and co-exist with, the greater the potential for disturbance (RF interference) among them. The largest challenge for these emerging applications will be RF compliance, not only with regard to regulatory requirements, but also there will be greater emphasis on operational environments to ensure proper performance, and public safety. These emerging technologies will continue to grow and influence commercial, automotive, and defense industries through 2020. This presentation will discuss new product features and methodology requiring greater awareness of the EMC environment in which they operate, and new test approaches.

Bio: Sangam Baligar is an Applications Engineer for AR RF/Microwave Instrumentation’s Radiated and Conducted Immunity Systems and test software. Sangam is actively involved in product and system design, development, compliance, Product safety and testing as well as worldwide sales and customer support. Sangam has 9 years of extensive experience in aerospace, automotive, consumer electronics, and Information technology and customer service.